Multi-chip modules mcms with high wiring density controlled impedance interconnects and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. Mcm-c mixed technologies and thick film sensors highlights recent advances in mcm-c technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks high performance-low temperature dielectric tapes precision via generation by both laser and mechanical methods and enhanced screen printing technologies have given us feature resolution to the 50 mum line space level. Thermal management has greatly benefitted from such new materials as cofire ain and diamond. Mcm-c technology is compatible with thick film sensors and work is reviewed on environmental gas sensors pressure and temperature sensors and the development of novel materials in this area.
